Aluminium PCB Design Guidelines | rules | IMS | MCPCB | printed circuits
Aluminium PCB Design Guidelines / Rules (IMS / MCPCB)
Downloads
| Name | Type | Size | Download |
|---|---|---|---|
| Technology - Rigid Aluminium-IMS-Printed Circuits (291,53 KB, PDF) | 292 KB | Download | |
| Layer Stack-Ups - Aluminium-IMS Circuit Boards - Rev 6.0(124,35 KB, PDF) | 124 KB | Download |
Design rules
| Options and Characteristics - Aluminium-IMS-Printed Circuits - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Quantity | 1 piece up to 1,0m² total area | from 1 piece to mass production |
| Layer quantity | 1 layer | up to 6 layers |
| Material thickness (1-layer) | 1,0mm; 1,55mm; and 2,0mm | 0,30mm to 4,0mm |
| Material thickness (2-layers) | 1,55mm | 0,30mm to 4,0mm |
| Material thickness (4- to 6-layers) | not possible | 1,6mm |
| Copper thickness (1- and 2-layers) | 35µm and 70µm | 35µm, 70µm, 105µm |
| Copper thickness (4- to 6-layers) | not possible | 35µm |
| Material colour | beige / fawn epoxy / grey aluminium | beige / fawn epoxy / grey aluminium |
| Base material type | Aluminium 5052 alloy / Isolation: FR4 Tg 130° C | copper, AL1060, AL3003 |
| Maximum operating temperature | ca. 110° C | ca. 110° C |
| Minimum operating temperature | ca. -40° C | down to ca. -40° C |
| Silk print layer | none, top | none, top, bottom, double sided |
| Solder mask colour | green, white, black, blue and red | green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale) |
| Silk print colour | white, black respectively on white solder mask | black, blue, yellow, red |
| Via-Filling (no copper lid) | not possible | possible |
| Electric test | possible (flying probe) | possible, also adapter |
| Plugging (with copper lid, e.g. for "via-in-pad technology" | not possible | possible |
| Peelable mask | not possible | top, bottom or double sided |
| Beveling | not possible | possible |
| Surface finish | HAL lead free | HAL lead free, immersion gold (ENIG), OSP |
| Finger gold | not possible | not possible |
| Long term tempering | not possible | possible |
| Maximum aluminium-IMS-printed circuit board size 1 and 2 layers IMS-Aluminium PCB | 280 x 420mm | 420 x 580 mm² |
| Maximum aluminium-IMS-printed circuit board size for aluminium-IMS multilayer PCBs | not possible | 230 x 360mm² |
| Minimum aluminium-IMS singulated circuit board size | 3cm², smaller can be calculated but will be panelized | >1cm² <3cm² on enquiry |
| Minimum aluminium-IMS circuit boar size in v-cut panels | not possible | <10x10mm² on enquiry |
| Minimum aluminium-IMS circuit boar size in routing panels | 10x10mm² / 1cm² | <5x5mm² on enquiry |
| Minimum aluminium-MS printed circuit board width | 5mm | <5mm on enquiry |
| Lead time options 1 layer aluminium-IMS printed circuits | 4WD, 5WD, 7WD, 10WD | In-day-service and over-night-service |
| Lead time options 2-ayers aluminium-IMS multilayer printed circuits | not possible | starting at 10WD |
| Lead time options 4- to 6 layers multilayer printed circuits | not possible | starting at 20WD |
| Routing | always | always, except punching |
| V-cut | not possible | possible |
| Jump-v-cut | not possible | possible |
| Punching | not possible | possible |
| Counter-sink-holes | not possible | possible |
| Z-axis milling | not possible | possible |
| Aluminium-IMS special stack-up | not possible | possible |
| Panel Production - Aluminium-IMS Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| V-cut panel | possible | possible |
| V-Cut - ALU routing panel (combination) | possible | possible |
| Multi panels (more than one layout per panel) | possible | possible |
| Panel setup (chosen by Leiton) | possible | possible |
| Panel setup (according to drawing) | possible | possible |
| PTH-drills (plated drills) - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill 35µm (final diameter) | 0,30mm | 0,10mm |
| Smallest drill 70µm (final diameter) | 0,30mm | 0,30mm |
| Smallest drill 105µm (final diameter) | not possible | 0,30mm |
| Smallest drill 140µm (final diameter) | not possible | not possible |
| Smallest drill 210µm (final diameter) | not possible | not possible |
| Smallest drill 280µm (final diameter) | not possible | nicht möglich |
| Smallest drill 400µm (final diameter) | not possible | nicht möglich |
| Smallest annular ring 35µm | 0,20mm | 0,20mm |
| Smallest annular ring 70µm | 0,20mm | 0,20mm |
| Smallest annular ring 105µm | not possible | 0,20mm |
| Smallest annular ring 140µm | not possible | not possible |
| Smallest annular ring 210µm | not possible | not possible |
| Smallest annular ring 280µm | not possible | not possible |
| Smallest annular ring 400µm | not possible | not possible |
| Possibel drill diameters | 0,30mm to 1,6mm in 0,05mm steps | 0,10mm to 2,2mm in 0,05mm steps |
| Drills >5,5mm | not possible | routed |
| Smallest drill distance 1-layer aluminium-IMS-circuits (drill edge to drill edge) | 0,40mm | 0,40mm |
| Smallest drill distance 2-layers aluminium-IMS-circuits (drill edge to drill edge) | 0,80mm | 0,80mm |
| Intersecting drills | not possible | not possible, will be routed |
| Half-open PTH on PCB edge | not possible | not possible |
| NPTH-drills (non-plated drills) - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smalles drill size (final diameter) | 1,0mm | 0,30mm |
| Possible drill sizes | 1,0mm to 5,5mm in 0,05mm steps | 0,30mm to 5,5mm in 0,05mm steps |
| Copper clearance / distance to copper | 0,20mm | 0,20mm |
| Drills >5,5mm | routed | routed |
| Minimum drill-to-edge distance | 0,50mm | 0,50mm |
| Smallest drill distance 1-layer aluminium-IMS-circuits (drill edge to drill edge) | 0,40mm | 0,40mm |
| Smallest drill distance 2-layers aluminium-IMS-circuits (drill edge to drill edge) | not possible | 0,70mm |
| Intersecting drills | not possible, will be routed | not possible, will be routed |
| NPTH drills in copper area (without clearance) | not possible (will be cleared from copper by min. 0,2mm) | on explicit requirement only |
| Blind Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest blind via (final diameter) | not possible | not possible |
| Smallest Aspect-Ratio | not possible | not possible |
| Smallest annular ring | not possible | not possible |
| Buried Vias - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest buried via (final diameter) | not possible | not possible |
| Routing (non-plated) - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing NPTH | possible | possible |
| Smallest inner routing NPTH | 2,0mm | 1,0mm |
| Available routing diameters NPTH | 2,0mm | 1,0 up to 2,2mm in 0,10mm steps |
| Smallest radius (inner corners) NPTH | 1,0mm | 0,5mm |
| Routing (plated) - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing PTH | not possible | possible |
| Smallest PTH inner routing (final diameter) | not possible | 0,90mm |
| Edge plating (outer edge) | not possible | not possible |
| Special routing paths with plating (inner) | not possible | possible |
| Available routing diameters PTH (final diameter) | not possible | 0,90mm up to 1,9mm in 0,10mm steps |
| Smallest radius (inner corner, final) PTH | not possible | 0,45mm |
| Smallest annular ring | not possible | 0,25mm |
| Copper Layers (outer) - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18µm | not possible | 0,09mm |
| Smallest trace 35µm | 0,15mm | 0,10mm |
| Smallest trace 70µm | 0,20mm | 0,15mm |
| Smallest trace 105µm | not possible | 0,40mm |
| Smallest trace 140µm | not possible | not possible |
| Smallest trace 210µm | not possible | not possible |
| Smallest trace 280µm | not possible | not possible |
| Smallest trace 400µm | not possible | not possible |
| Smallest trace-to-trace distance 18µm | not possible | 0,10mm |
| Smallest trace-to-trace distance 35µm | 0,15mm | 0,10mm |
| Smallest trace-to-trace distance 70µm | 0,20mm | 0,15mm |
| Smallest trace-to-trace distance 105µm | not possible | 0,40mm |
| Smallest trace-to-trace distance 140µm | not possible | not possible |
| Smallest trace-to-trace distance 210µm | not possible | not possible |
| Smallest trace-to-trace distance 280µm | not possible | not possible |
| Smallest trace-to-trace distance 400µm | not possible | not possible |
| Smallest drill pad | drill siez +0,30mm | drill size +0,20mm |
| Smallest copper clearance to inner routing | 0,30mm | 0,25mm |
| Smallest copper clearance to board edge (routing) | 0,30mm | 0,25mm |
| Smallest copper clearance to board edge (v-cut) | 0,50mm | 0,50mm |
| Copper Layers (inner) - Aluminium-IMS-Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18µm | not possible | 0,09mm |
| Smallest trace 35µm | not possible | 0,10mm |
| Smallest trace 70µm | not possible | 0,15mm |
| Smallest trace 105µm | not possible | not possible |
| Smallest trace-to-trace distance 18µm | not possible | 0,10mm |
| Smallest trace-to-trace distance 35µm | not possible | 0,10mm |
| Smallest trace-to-trace distance 70µm | not possible | 0,20mm |
| Smallest trace-to-trace distance 105µm | not possible | not possible |
| Smallest drill-pad diameter | not possible | 0,60mm |
| Smallest copper clearance to outer edges (routed) | not possible | 0,30mm |
| Smallest copper clearance to inner edges (routed) | not possible | 0,30mm |
| Smallest copper clearance to drills | not possible | 0,30mm |
| Solder Mask - Aluminium-IMS-Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
 Smallest solder mask web (straight) |
0,12mm | 0,10mm |
| Smallest solder mask web (straight) |
0,15mm | 0,15mm |
 Smallest solder mask web (round) |
0,075mm | 0,05mm |
 smallest solder maks size around copper |
0,075mm | <0mm |
| Smallest text lines | 0,25mm | 0,20mm |
| Silk Print - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest lines | 0,20mm | 0,15mm |
| Smallest distance between lines | 0,20mm | 0,15mm |
| Minimum clearance to copper pads | 0,20mm | 0,15mm |
| Carbon Print - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest pad-to-pad distance | not possible | 0,30mm |
| Tolerances, Values, Marks & Norms - Aluminium-IMS-Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Max. offset drill centre to centre of reference | 0,10mm | 0,05mm |
| Max. offset soldermask / copper structures | 0,15mm | 0,075mm |
| Finished drill sizes PTH (<=0,50mm) | not possible | -0/+0,10 |
| Finished drill sizes PTH (0,55 to 3mm) | not possible | -0/+0,10mm |
| Finished drill sizes PTH (>3mm) | not possible | -0/+0,10mm |
| Finished drill sizes NPTH (up to 6mm) | -0,05/+0,20mm | -0/+0,10mm |
| Finished drill sizes NPTH (>6mm) | -0,05/+0,20mm | -0/+0,10mm |
| Outline | +/-0,20mm | +/-0,10mm |
| Max. offset outline/copper structures | +/-0,20mm | +/-0,10mm |
| V-cut depth | not possible | +/-0,20mm |
| Z-axis milling | not possible | +/-0,20mm |
| V-Cut position to copper structures | not possible | +/-0,15mm |
| Etch tolerance copper thickness 18µm | not possible | +0/-0,02mm |
| Etch tolerance copper thickness 35µm | +0/-0,03mm | +0/-0,03mm |
| Etch tolerance copper thickness 70µm | +0/-0,05mm | +0/-0,05mm |
| Etch tolerance copper thickness 105µm | not possible | +0/-0,08mm |
| Etch tolerance copper thickness 140µm | not possible | not possible |
| Etch tolerance copper thickness 210µm | not possible | not possible |
| Etch tolerance copper thickness 280µm | not possible | not possible |
| Etch tolerance copper thickness 400µm | not possible | not possible |
| Material thickness tolerances | +/-10% | differs, please enquire |
| Copper thickness tolerances | +20% / -15% | +/-10% |
| Immersion tin thickness | not possible | not possible |
| HAL lead free thickness | >= 8- bis 10µm, edges >0,5µm | >= 8- bis 10µm, edges >0,5µm |
| HAL lead thickness | not possible | not possible |
| Immersion gold for soldering (nickel thickness | not possible | 3µm to 6µm |
| Immersion gold for soldering (gold thickness) | not possible | 0,07µm to 0,12 µm |
| Immersion gold for gold-wire bonding (nickel thickness) | not possible | not possible |
| Immersion gold for gold-wire bonding (gold thickness) | not possible | not possible |
| Immersion gold for aluminum-wire bonding (nickel thickness) | not possible | 3µm to 6µm |
| Immersion gold for aluminum-wire bonding (gold thickness) | not possible | 0,07µm to 0,12 µm |
| Electrolytic connector gold - soft, bonding possible (nickel thickness) | not possible | not possible |
| Electrolytic connector gold - soft, bonding possible (gold thickness) | not possible | not possible |
| Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) | not possible | not possible |
| Electrolytic connector gold - hard, bonding NOT possible (gold thickness) | not possible | not possible |
| Wet solder laquer thickness | >15µm | >15µm |
| Copper thickness in plated hole, traces 35µm | minimum 18µm | minimum 20µm |
| Copper thickness in plated hole, traces 70µm | minimum 18µm | minimum 20µm |
| Copper thickness in plated hole, traces 105 to 210µm | not possible | minimum 20µm |
| hickness in plated hole, traces 280 to 400µm | not possible | minimum 20µm |
| Winding | max. 1% | max. 0,5% |
| Warping | max. 1% | max. 0,5% |
| Beveling angle | not possible | not possible |
| Base materials RoHS-compliance | yes, always | yes, always |
| Surface finish RoHS-compiance | yes, always | always, unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600 - Class 2, if applicable | IPC-A-600 - Class 1, 2 or 3, if applicable |
| UL-approval of printed circuits (UL number, logo, date code) | not possible | UL94V0 possible |
| UL-approved base material | yes, always | possible |
| Insertion of date code | possible, please mention in enquiry | possible, please mention in enquiry |
| Insertion of supplier logo (Leiton) | possible, please mention in enquiry | possible, please mention in enquiry |
| DIN EN ISO 9001 certification work preparation, CAM and order management over Leiton | yes | yes |
| DIN EN ISO 9001 certification of printed circuit board production | no | possible |
| DIN EN ISO 14001 certification of printed circuit board production | no | possible |
| DIN EN ISO 16949 certification of printed circuit board production | no | possible |
Read more about aluminium-IMS-PCBs design, layout and development in our special technology section.
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